Ceramic Small Outline Packages

Ceramic small outline package csop national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.

Ceramic small outline packages.

Mm lead count cavity overall layer thickness lead ntk material code b black w white connection 0 non conect drawing no. Ceramic packages for large scale integration lsi devices. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn.

Material in laminated ceramic packages. Also used as a structural material in ceramic. Copper cu a copper alloy a copper nickel tin alloy is used as the lead frame material in plastic packages. Lead count cavity overall layer t hic kness total 0084 0085 0085 0085 lead nt k mat erial code ring connection drawing no o non co ne ct attach.

Ceramic substrates for probe cards. Standard packages and lids for device evaluation. Material properties process flow. Up u down d 1st 2nd 3rd total pitch stand off height seal ring.